SAE AMS2690, revision A
Parallel Gap, Welding, Microelectronic Interconnections to Thin Film Substrates (NONCURRENT)
Month of publication: 1982-04-01
Developed by committee: Ams B Finishes Processes And Fluids Committee
Other revisions of this standard: rev. B, rev. C
Annotation and contents
Source of this annotation and contents: SAE.
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.